THE BEST SIDE OF NOOHAPOU

The best Side of Noohapou

The best Side of Noohapou

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distant areas: Static models are typically located remotely, growing cost and reducing In general procedure effectiveness.

thirty% of its peak energy intake, giving our buyers significant reduction in functioning charges and improved trustworthiness.

While using the POU3500, you may accomplish unprecedented ends in etch general performance, chamber uptime, lowered expense of ownership and fab Room utilization – all although bettering your procedure reliability.

Originally Established in 1985, our firm has grown into a acknowledged leader in offering temperature Manage systems to the global semiconductor industry.

This exceptional procedure, offering a little sort issue, affordable-of-Ownership and Dynamic Temperature Management offered procedure and products engineers a brand new tool to improve their temperature sensitive processes.

The accuracy of the POU 3300 allows for unbiased control of the process fluid temperature to the wafer chuck inside of +/- 0.one °C of established place, plus the rapidly reaction time of the system allows for optimum wafer-to-wafer repeatability all through the etch approach.

All static TCUs involve extra cooling & heating capacities due to their incredibly substantial method fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Management procedure is less than 1 gallon.

Along with the POU3300, you are able to achieve unparalleled leads to etch overall performance, chamber uptime, lowered cost of possession and fab Area utilization – all although improving upon your course of action dependability.

the info pertains to the 300mm chamber temperature profile throughout a higher factor ratio Etch approach, running at really substantial RF power circumstances (~3.8kW). The powerful elements of this details set are:

Dynamic Temperature Management, as executed in programs much like the LAUDA-Noah POU, is definitely an approach that senses the temperature of the procedure fluid returning from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of your provided procedure fluid according to this authentic-time comments.

the information established here is from the 200mm volume output wafer fab and Obviously illustrates the advantage of the LAUDA-Noah POU technique.

in excess of at any time, shrinking machine geometries, demanding new processes as well as a really competitive atmosphere call for temperature Command devices that Incorporate fast and correct temperature control with an emphasis on reduced working expenditures and improved dependability.

The reality is the fact that correct Dynamic Temperature Regulate can only be reached when all 5 (five) of the next process layout and installation necessities are fulfilled:

(for that reason, putting get more info in a static unit beside chamber will never empower it to supply dynamic temperature Management)

We have to have a lot less cooling/heating capability for the same application as being a static TCU as a result of our compact reservoir volume.

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